Global Underfill Market Size, Share - Industry Trends and Forecast 2016 - 2024
"The
Report Underfill Market - Global Industry Analysis, Size, Share,
Growth, Trends, and Forecast 2016 - 2024 provides information on
pricing, market analysis, shares, forecast, and company profiles for
key industry participants. - MarketResearchReports.biz"
Underfill
materials are composite formulations of organic polymers and
inorganic fillers which are used in semiconductor packaging to
achieve improved thermo mechanical performance. Polymer adhesives are
used as underfill material to distribute mechanical stresses at
solder joint which occurs due to difference in the thermal expansion
coefficients at the interconnect. Various phenolic and amine based
epoxy materials are used as underfill material in semiconductor
packaging industry. High thermal stability and reworkability are
desired characteristics for underfill material in the semiconductor
packaging industry. They are used in various packaging techniques
such as flip chip, ball grid array (BGA), and chip scale packaging
(CSP), etc. Flip chip is a major application for underfill material.
Global flip chip market is showing strong demand and is estimated to
witness double digit growth in near future. The ever growing demand
for lighter, smaller, efficient yet cost effective devices has drawn
remarkable attention towards the underfill material. Capillary
underfill (CUF), no flow underfill (NUF), and molded underfill (MUF)
techniques are used for the application of underfill materials. Due
to growing pricing pressure from end use industry, CUF being a
conventional and relatively costly technique is replaced by MUF
process technique. The global semiconductor packaging industry, a
parent market for the global underfill material market is expected to
continually expand at high growth rates in near future.
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Global
Underfill Materials Market Dynamics
Recently,
the microelectronic industry is governed by more complex devices, due
to trending system on chip (SOC) and system in package (SIP). The
trends in portable end use market are driving the global underfill
material market growth. The growing demand for low cost, high
performing, small in size devices is one of the major driving factors
for global underfill material market growth. The increasing use of
underfill material from flip chip packaging and wafer level packaging
due growing demand in smart phones and tablets is a prominent driving
factor for global underfill material market growth. Being a
technology driven market, underfill material market is expected to be
compelled by the recent advancements in electronic industry. The end
use market is posing new requirement of compatibility with lead free
solder paste material due latest trend of sustainability in the
market. Some of the leading manufacturers in the market are offering
underfill material products which are compatible with lead free
solder paste.
Global
Underfill Material Market Segmentation
The
global underfill material market is segmented on the basis of product
type and application. On the basis of product type, the global
underfill material market is classified as
CUF
underfill material
NUF
underfill material
MUF
underfill Material.
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Among
these segments, CUF is an oldest type and accounts for maximum share
in global underfill market. Due to high cost, the CUF is anticipated
to be replaced by MUF materials in near future. The MUF product type
segment is estimated to show highest growth in near future.
On
the basis of application, the global underfill material market is
segmented as
Flip
chips
Ball
grid array (BGA)
Chip
scale packaging (CSP)
The
flip chip application segment is expected to exhibit strong demand
for underfill material compared to other application segments.
Global
Underfill Material Market: Regional Outlook
On
the basis of geography, global underfill material market can be
divided by major regions which include North America, Western Europe,
Eastern Europe, Asia-Pacific Excluding Japan, Japan, Middle East and
Africa, and Latin America. Asia Pacific is a largest market for
underfill materials with China, Korea, Japan, and Taiwan being
prominent countries producing semiconductor packaging materials.
North America and Europe are the largest market after Asia.
Global
Underfill Material Market Players
Some
of the major players in global underfill material market are Henkel,
Won Chemicals Co. Ltd., Epoxy Technology Inc., AIM solder, Namics
Corporation.
The
report offers a comprehensive evaluation of the market. It does so
via in-depth qualitative insights, historical data, and verifiable
projections about market size. The projections featured in the report
have been derived using proven research methodologies and
assumptions. By doing so, the research report serves as a repository
of analysis and information for every facet of the market, including
but not limited to: Regional markets, technology, types, and
applications.
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Market
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Supply
and demand
Market
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Current
trends/opportunities/challenges
Competitive
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Technological
breakthroughs
Value
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regional analysis covers:
North
America (U.S. and Canada)
Latin
America (Mexico, Brazil, Peru, Chile, and others)
Western
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Belgium, Netherlands, Luxembourg)
Eastern
Europe (Poland, Russia)
Asia
Pacific (China, India, Japan, ASEAN, Australia and New Zealand)
Middle
East and Africa (GCC, Southern Africa, North Africa)
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